MPC562CZP66

NXP USA Inc.

General info

Part Number

MPC562CZP66

Manufacturer

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 388PBGA

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MPC562CZP66

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Product details

NXP USA Inc.'s MPC562CZP66 sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The PowerPC core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 32-Bit Single-Core processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 66MHz, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.With CANbus, EBI/EMI, SCI, SPI, UART/USART protocol support, the device forms the backbone of in-vehicle networks, providing deterministic communication between ECUs with <100ns synchronization accuracy.The comprehensive POR, PWM, WDT suite includes automotive-specific features like crank-angle measurement interfaces and injector drive timers, reducing external component count in engine management systems.64 programmable interfaces support mixed-voltage operation from 1.8V to 5V, simplifying integration with legacy automotive sensors and actuators.The ROMless implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.32K x 8 of parity-protected memory prevents data corruption from alpha particle strikes, meeting ISO 26262 requirements for safety-critical storage.An automotive-grade 2.5V ~ 2.7V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.The A/D 32x10b configuration achieves 90dB SNR for precise battery current sensing in hybrid/electric vehicles, enabling state-of-charge accuracy within 1%.External clocking architecture maintains <50ppm frequency stability across the entire automotive temperature range, ensuring reliable CAN bus timing.Qualified for -40°C ~ 85°C (TA), the device operates reliably in dashboard locations where ambient temperatures can exceed 85 C during summer conditions.The Surface Mount option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.388-BBGA packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.Available in 388-PBGA (27x27), the microcontroller supports AEC-Q100 Grade 1 qualification for deployment in safety-relevant automotive systems.