MP2-H060-54S1-S-LR
3M
MP2-H060-54S1-S-LR
3M
CONN HEADER FUTUREBUS+ 60POS PCB
Reference Price (USD)
1+
$7.35205
500+
$7.2785295
1000+
$7.205009
1500+
$7.1314885
2000+
$7.057968
2500+
$6.9844475
Exquisite packaging
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MP2-H060-54S1-S-LR
$7.35
Product details
The MP2-H060-54S1-S-LR by 3M revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Specifically developed for Backplane implementations, this series excels in co-packaged optics interconnect applications.Featuring Header, Male Pins configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.The Futurebus+® design incorporates advanced crosstalk suppression techniques, critical for maintaining eye diagram integrity in high-speed serial links.With 60 available positions, this solution enables unprecedented port density for top-of-rack switching equipment.The All loaded variant offers power-efficient solutions for partial population scenarios in server backplanes.The 0.079" (2.00mm) micro-pitch design enables breakthrough density while maintaining impedance control for 112G SerDes channels.5 row configuration supports orthogonal direct-attach copper architectures in disaggregated server designs.Through Hole installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.The Solder process has been optimized for low-void solder joints in mass reflow processes per IPC-7095C standards.Key Board Guide, Mating Guide include integrated heat spreaders and airflow-optimized housings for thermal management in high-performance computing applications.Gold plating technology provides superior wear resistance exceeding 10,000 mating cycles for data center hot-swap scenarios.3.00µin (0.076µm) coating thickness ensures compliance with IEC 60512-99-001 fretting corrosion requirements.The Beige housing material incorporates laser-markable surfaces for traceability in automated manufacturing environments.
Product Attributes
- Product Status: Active
- Connector Usage: Backplane
- Connector Type: Header, Male Pins
- Connector Style: Futurebus+®
- Number of Positions: 60
- Number of Positions Loaded: All
- Pitch: 0.079" (2.00mm)
- Number of Rows: 5
- Number of Columns: -
- Mounting Type: Through Hole
- Termination: Solder
- Contact Layout, Typical: -
- Features: Board Guide, Mating Guide
- Contact Finish: Gold
- Contact Finish Thickness: 3.00µin (0.076µm)
- Color: Beige
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