MNT-112-BK-G

The MNT-112-BK-G from Samtec Inc. is a high-performance component in the Shunts, Jumpers category, engineered for precision signal transmission in mission-critical applications. This interconnect solution delivers exceptional electrical performance while maintaining robust mechanical integrity across demanding operating conditions.Designed as Open Top, this configuration ensures optimal current flow with enhanced contact reliability. When compared to standard shunts, its open-top/grip design provides 30% better heat dissipation.Featuring Female Sockets contacts, this interconnect system enables versatile mating configurations while maintaining signal integrity. The gold-plated variants exhibit superior corrosion resistance in humid environments.With 24 (2 x 12) matrix arrangement, this component supports high-density PCB layouts. The symmetrical pin distribution minimizes crosstalk in high-frequency applications.The 0.100" (2.54mm) spacing configuration optimizes board real estate utilization while preventing arc-over in high-voltage scenarios. This pitch specification meets IPC-2221 standards for creepage and clearance.At 0.240" (6.10mm) profile height, this low-profile solution enables compact designs in space-constrained applications. The dimensional stability remains consistent across -40 C to +125 C operating range.The Gold surface treatment delivers <0.5m contact resistance, ensuring reliable power transmission. Gold finishes maintain stable contact resistance through 10,000 mating cycles.10.0µin (0.25µm) plating thickness exceeds MIL-STD-202H requirements for wear resistance. This specification guarantees consistent impedance characteristics across the contact interface.The Black housing provides visual identification in complex assemblies while meeting UL94 flammability standards. Color-coding supports error-proofing in high-volume production environments.With UL94 V-0 certification, this component meets stringent safety requirements for industrial control systems. The self-extinguishing material prevents flame propagation.Constructed from Liquid Crystal Polymer (LCP), the housing maintains dimensional stability under thermal stress. This engineering thermoplastic offers excellent resistance to solvents and cleaning agents.Rated for 3.9A per Contact, this interconnect handles power distribution needs in motor control applications. The design incorporates thermal management features for sustained high-current operation.