MM908E622ACPEKR2

NXP USA Inc. introduces MM908E622ACPEKR2, a breakthrough in Embedded - Microcontrollers - Application Specific for high-speed data acquisition systems. This application-specific microcontroller combines 16-bit ADCs with jitter-cleaning PLLs, enabling precision measurement in test and measurement equipment.Engineered for Automotive Mirror Control implementations, the device includes hardware-accelerated windowed FFT processing. The analog front-end achieves 90dB SFDR at 10MSPS sampling rates.The HC08 architecture features SIMD operations for vectorized signal processing. The deterministic interrupt latency ensures precise timing of acquisition triggers.With FLASH (16kB) flexibility, the memory subsystem supports real-time waveform storage. The dual-bank architecture enables continuous streaming without throughput gaps.As a member of the 908E family, this device shares calibration algorithms with related products. The consistent measurement API simplifies instrument design.The 512 x 8 memory implements ECC protection for measurement integrity. The multi-port architecture allows simultaneous access from acquisition and processing units.The SCI, SPI connectivity includes JESD204B serial links with 12.5Gbps lanes. Each transceiver implements adaptive equalization for long-reach backplane connections.Providing 12 configurable ports, the device supports direct sensor excitation. Each analog output includes 20-bit calibration coefficients in OTP memory.Operating from 9V ~ 16V sources, the power architecture achieves 100dB PSRR. The integrated voltage references maintain 1ppm/ C stability for precision measurements.Rated for -40°C ~ 85°C operation, the package uses low-thermal EMF materials. The symmetrical design minimizes thermocouple effects in sensitive circuits.The Surface Mount configuration supports impedance-controlled PCB layouts. The package footprint includes guard ring connections for sensitive analog sections.Available in 54-SSOP (0.295", 7.50mm Width) Exposed Pad format, the package features gold-plated pads for contact reliability. The low-ESL design maintains signal integrity up to 3GHz bandwidth.Supplied in 54-SOIC-EP configuration, each unit includes individual calibration reports. Production testing includes full characterization across temperature.