MIMX8MN5CVPIZAA
NXP USA Inc.
MIMX8MN5CVPIZAA
NXP USA Inc.
I.MX 8M NANO ULTRALITE
Reference Price (USD)
1+
$32.26000
500+
$31.9374
1000+
$31.6148
1500+
$31.2922
2000+
$30.9696
2500+
$30.647
Exquisite packaging
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MIMX8MN5CVPIZAA
$32.26
Product details
NXP USA Inc.'s MIMX8MN5CVPIZAA sets new benchmarks in the Embedded - Microprocessors market segment, optimized for compute-intensive embedded applications. This system-on-chip solution integrates advanced processing cores with sophisticated power management, delivering exceptional performance-per-watt characteristics for energy-conscious designs.The ARM® Cortex®-A53, ARM® Cortex®-M7 architecture provides deterministic execution of real-time tasks while maintaining low power consumption, making it particularly suitable for battery-powered edge computing devices.Architected with 4 Core, 64-Bit capability, the processor enables efficient task partitioning and memory bandwidth utilization in multi-threaded applications.With clock speeds up to 1.4GHz, the device meets the computational demands of advanced motor control algorithms and power conversion systems.The Multimedia; NEON™ MPE acceleration units significantly enhance performance for matrix operations common in AI inference tasks.Support for DDR3L, DDR4, LPDDR4 memory technologies allows designers to optimize system cost and performance for specific application requirements.The Yes graphics subsystem enables smooth rendering of complex graphical user interfaces without external GPU components.Integrated LCD, MIPI-CSI, MIPI-DSI interfaces support direct connection to modern display technologies, reducing BOM costs in HMI applications.GbE connectivity options provide the necessary bandwidth for industrial communication protocols including EtherCAT and PROFINET.USB 2.0 OTG + PHY (1) implementations adhere to the latest USB standards, ensuring backward compatibility while supporting high-speed data transfers.Qualified for -40°C ~ 105°C (TJ) operation, the processor reliably functions in outdoor telecommunications equipment and base station applications.Comprehensive ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS protect against both physical and network-based attacks, crucial for financial terminals and secure access systems.The 306-TFBGA package design incorporates advanced thermal management features for reliable operation in confined spaces.Offered in 306-TFBGA (11x11), the device supports both conventional and advanced PCB assembly techniques.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
- Number of Cores/Bus Width: 4 Core, 64-Bit
- Speed: 1.4GHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: DDR3L, DDR4, LPDDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
- Ethernet: GbE
- SATA: -
- USB: USB 2.0 OTG + PHY (1)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
- Package / Case: 306-TFBGA
- Supplier Device Package: 306-TFBGA (11x11)
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