MIMX8MN1DVPIZAA
NXP USA Inc.
MIMX8MN1DVPIZAA
NXP USA Inc.
I.MX 8M NANO ULTRALITE
Reference Price (USD)
1+
$21.13821
500+
$20.9268279
1000+
$20.7154458
1500+
$20.5040637
2000+
$20.2926816
2500+
$20.0812995
Exquisite packaging
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MIMX8MN1DVPIZAA
$21.14
Product details
NXP USA Inc.'s MIMX8MN1DVPIZAA redefines power efficiency in the Embedded - Microprocessors segment, crafted for energy-harvesting IoT endpoints. This ultra-low-power microprocessor combines near-threshold voltage operation with intelligent power gating, achieving microampere-level standby currents for decade-long battery life in wireless sensor nodes.The ARM® Cortex®-A53, ARM® Cortex®-M7 ultra-low-power core maintains full register retention at subthreshold voltages, enabling seamless operation from energy harvesting sources.Designed with 2 Core, 64-Bit configuration, the processor optimizes power distribution across multiple low-power domains.Operating at 1.4GHz in burst modes, the device balances performance and power consumption for intermittent computing applications.The Multimedia; NEON™ MPE sensor hub offloads signal processing tasks at microamp current levels.The DDR3L, DDR4, LPDDR4 memory architecture implements state-retentive power gating for zero-leakage data preservation during sleep modes.Yes display controller operates with adaptive refresh rates to minimize power consumption in e-paper applications.LCD, MIPI-CSI interfaces support direct connection to ultra-low-power displays common in wearable devices.GbE PHY includes energy-efficient Ethernet support for green networking applications.The USB 2.0 OTG + PHY (1) interface implements low-power link states while maintaining instant wake-on-connect functionality.Specified for 0°C ~ 95°C (TJ) operation, the processor maintains functionality in environmental monitoring applications.Power-optimized ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS include cryptographic accelerators with minimal energy overhead for secure IoT communications.The 306-TFBGA package minimizes thermal mass for rapid wake-up from deep sleep states.Offered in 306-TFBGA (11x11), the device supports thin-film battery integration in wearable designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
- Number of Cores/Bus Width: 2 Core, 64-Bit
- Speed: 1.4GHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: DDR3L, DDR4, LPDDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD, MIPI-CSI
- Ethernet: GbE
- SATA: -
- USB: USB 2.0 OTG + PHY (1)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 95°C (TJ)
- Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
- Package / Case: 306-TFBGA
- Supplier Device Package: 306-TFBGA (11x11)
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