MIMX8ML8CVNKZAB
NXP USA Inc.
MIMX8ML8CVNKZAB
NXP USA Inc.
IC I.MX 8M PLUS QUAD BGA
Reference Price (USD)
1+
$67.30000
500+
$66.627
1000+
$65.954
1500+
$65.281
2000+
$64.608
2500+
$63.935
Exquisite packaging
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MIMX8ML8CVNKZAB
$67.30
Product details
The MIMX8ML8CVNKZAB by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A53 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 4 Core, 64-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 1.8GHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The DDR4, LPDDR4 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.Yes GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting MIPI-CSI, MIPI-DSI outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.GbE (2) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 + PHY (2), USB 3.0 + PHY (2) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Rated for -40°C ~ 105°C (TJ) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented ARM TZ, CAAM, RDC include model encryption and secure model update mechanisms for protected edge AI deployments.The 568-LFBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 568-LFBGA (15x15), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A53
- Number of Cores/Bus Width: 4 Core, 64-Bit
- Speed: 1.8GHz
- Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
- RAM Controllers: DDR4, LPDDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: MIPI-CSI, MIPI-DSI
- Ethernet: GbE (2)
- SATA: -
- USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: ARM TZ, CAAM, RDC
- Package / Case: 568-LFBGA
- Supplier Device Package: 568-LFBGA (15x15)
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