MIMX8MD6CVAHZAA
NXP USA Inc.
MIMX8MD6CVAHZAA
NXP USA Inc.
I.MX 8MDUAL 17X17 NO LID
Reference Price (USD)
1+
$73.27000
500+
$72.5373
1000+
$71.8046
1500+
$71.0719
2000+
$70.3392
2500+
$69.6065
Exquisite packaging
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MIMX8MD6CVAHZAA
$73.27
Product details
NXP USA Inc.'s MIMX8MD6CVAHZAA redefines power efficiency in the Embedded - Microprocessors segment, crafted for energy-harvesting IoT endpoints. This ultra-low-power microprocessor combines near-threshold voltage operation with intelligent power gating, achieving microampere-level standby currents for decade-long battery life in wireless sensor nodes.The ARM® Cortex®-A53 ultra-low-power core maintains full register retention at subthreshold voltages, enabling seamless operation from energy harvesting sources.Designed with 2 Core, 64-Bit configuration, the processor optimizes power distribution across multiple low-power domains.Operating at 1.3GHz in burst modes, the device balances performance and power consumption for intermittent computing applications.The ARM® Cortex®-M4 sensor hub offloads signal processing tasks at microamp current levels.The DDR3L, DDR4, LPDDR4 memory architecture implements state-retentive power gating for zero-leakage data preservation during sleep modes.Yes display controller operates with adaptive refresh rates to minimize power consumption in e-paper applications.eDP, HDMI, MIPI-CSI, MIPI-DSI interfaces support direct connection to ultra-low-power displays common in wearable devices.GbE PHY includes energy-efficient Ethernet support for green networking applications.The USB 3.0 (2) interface implements low-power link states while maintaining instant wake-on-connect functionality.Specified for -40°C ~ 105°C (TJ) operation, the processor maintains functionality in environmental monitoring applications.Power-optimized ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS include cryptographic accelerators with minimal energy overhead for secure IoT communications.The 621-FBGA, FCBGA package minimizes thermal mass for rapid wake-up from deep sleep states.Offered in 621-FCPBGA (17x17), the device supports thin-film battery integration in wearable designs.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM® Cortex®-A53
- Number of Cores/Bus Width: 2 Core, 64-Bit
- Speed: 1.3GHz
- Co-Processors/DSP: ARM® Cortex®-M4
- RAM Controllers: DDR3L, DDR4, LPDDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
- Ethernet: GbE
- SATA: -
- USB: USB 3.0 (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
- Package / Case: 621-FBGA, FCBGA
- Supplier Device Package: 621-FCPBGA (17x17)
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