MI21-50PD-SF-EJR(71)

The MI21-50PD-SF-EJR(71) by Hirose Electric Co Ltd revolutionizes Memory Connectors - PC Card Sockets technology for satellite payload systems. This radiation-hardened connector solution maintains signal integrity in GEO orbit while withstanding total ionizing dose levels exceeding 100kRad.Supporting CompactFlash® - Type I, II standards, the connector enables reliable data transfer in space applications. Its triple-redundant contact system meets NASA EEE-INST-002 requirements for critical space systems.The 50 configuration has been optimized for spacecraft bus architectures. The contact arrangement minimizes single-point failure risks in mission-critical applications.Featuring Connector and Ejector design, this connector achieves outgassing levels below 0.1% TML. The materials have been qualified per ESA ECSS-Q-ST-70-02C standards.The Push In, Push Out mechanism enables operation with space-rated gloves. The positive-lock design prevents accidental disconnection during launch vibrations.The Right release mechanism functions reliably in zero-gravity conditions. The captive ejector prevents loose parts in microgravity environments.Engineered for Surface Mount, Right Angle installation, the connector withstands 100G shock loads. The reinforced mounting points survive pyrotechnic separation events.Incorporating Board Guide, this connector provides 360 EMI shielding effectiveness above 80dB. The multi-layer shielding approach meets MIL-STD-461G requirements for spacecraft.The 0.281" (7.15mm) ultra-low profile fits within tight satellite panel constraints. The design maintains structural integrity under thermal cycling from -150 C to +125 C.The Normal, Standard - Top option enables both conductive and isolated mounting configurations. The floating mount version prevents galvanic corrosion in dissimilar metal applications.Utilizing Gold technology, the contacts maintain stable resistance despite atomic oxygen exposure. The specialized plating prevents fretting corrosion in vacuum environments.With precision-controlled 3.94µin (0.10µm), the contacts achieve consistent performance through 500 mating cycles. The plating process has been qualified for space applications.