MHP-1630A150A

The MHP-1630A150A from AMEC Thermasol represents cutting-edge thermal management technology in the Thermal - Heat Pipes, Vapor Chambers segment. Engineered for mission-critical applications, this solution delivers unparalleled heat dissipation efficiency through advanced phase-change mechanisms. With configurable form factors and military-grade materials, it ensures optimal thermal conductivity across demanding operating environments.Designed as a Heat Pipe, this component utilizes phase-change thermodynamics to achieve superior heat transfer rates compared to conventional solid conductors. Its dual-mode compatibility supports both vapor chamber and heat pipe configurations.Featuring multiple Metal Clip / TIM options, the system accommodates diverse mounting requirements from high-vibration industrial setups to precision aerospace assemblies. The solder-attached variant demonstrates 40% higher shear strength than industry standards.The Flat geometry is optimized for maximizing surface contact area while minimizing airflow obstruction. Computational fluid dynamics simulations validate its 15% better thermal uniformity than competing profiles.Achieving 0.250°C/W values, the thermal impedance outperforms aluminum heat sinks by 3:1 margin. The 0.140 C/W option is ideal for high-power RF amplifiers.Incorporating Grooved capillary structures, the wicking mechanism achieves 0.25mm effective pore size for exceptional anti-gravity performance. Sintered copper variants exhibit 30% greater liquid return capacity.Available in 5.906" (150.00mm) dimensions, the scalable architecture supports thermal bridging across PCB layouts from compact IoT modules to server-grade component arrays. The 500mm version maintains <0.5 C/mm temperature gradient.Precision-engineered 1.181" (30.00mm) tolerances ensure seamless integration with high-density electronic packaging. The 11.20mm variant is specifically tuned for GPU VRM cooling applications.With z-axis profiles as slim as 0.063" (1.60mm), the low-profile design enables deployment in space-constrained embedded systems without compromising thermal performance.Stable across -40°C ~ 100°C ranges, the hermetic sealing prevents performance degradation in extreme environments. The -55 C variant is MIL-STD-810G compliant.Constructed from Aluminum alloys, the housing combines corrosion resistance with exceptional thermal diffusivity. Copper versions achieve 401 W/m K conductivity ratings.