MEC1723N-B0-I/LJ

Microchip Technology's MEC1723N-B0-I/LJ reimagines Embedded - Microcontrollers - Application Specific for smart grid and power conversion applications. This application-specific microcontroller integrates advanced PWM generation with high-resolution ADC capabilities, enabling precise control of power electronics.Optimized for Keyboard and Embedded Controller implementations, the device features hardware-based overcurrent protection with 50ns response time. The integrated sigma-delta modulators enable direct sensorless motor control.The ARM® Cortex®-M4F core includes dedicated trigonometric acceleration units. The parallel execution pipelines achieve 95% duty cycle accuracy at 100kHz switching frequencies.Supporting OTP (512kB) options, the flash memory incorporates shadow registers for bumpless firmware updates. The dual-plane architecture allows live updates during continuous operation.As a member of the MEC172x family, this device shares power library functions with related products. The consistent API simplifies migration between power stages.The 416kB memory implements deterministic access timing for control loops. The dual-port architecture allows simultaneous access from CPU and PWM units.With ACPI, EBI/EMI, eSPI, I²C, LPC, PECI, PS/2, QSPI, SPI, UART connectivity, the device supports EtherCAT POWERLINK protocols. Each communication peripheral includes reinforced isolation meeting IEC 61800-5-1 standards.The 155 configurable ports feature 12-bit DAC outputs for analog control. Programmable dead-time insertion prevents shoot-through in bridge configurations.Operating from 1.71V ~ 3.465V inputs, the power architecture withstands 100V transients. The integrated gate drivers support SiC and GaN power devices.Certified for -40°C ~ 85°C (TA) operation, the package uses direct-bonded copper substrates. Thermal impedance is minimized for high-current applications.The Surface Mount option supports press-fit assembly for high-power PCBs. The package design accommodates thick copper layers for heat dissipation.Available in 176-WFBGA format, the package includes Kelvin sense connections. The low-inductance design minimizes switching losses at high di/dt rates.Supplied in 176-WFBGA (10x10) configuration, each unit includes power cycling test reports. Production testing includes 100% burn-in at maximum junction temperature.