MEC1703Q-B2-I/TN

The MEC1703Q-B2-I/TN by Microchip Technology sets new benchmarks in Embedded - Microcontrollers - Application Specific, optimized for automotive electronics and rugged industrial applications. This application-specific microcontroller delivers military-grade reliability with automotive-qualified components, ensuring operation in the most demanding environments.Tailored for Keyboard and Embedded Controller deployments, the microcontroller includes ASIL-D compliant safety monitors. The dual-core lockstep architecture provides continuous fault detection for functional safety applications.Built around ARM® Cortex®-M4F technology, the CPU features cache coherency protocols for multi-core synchronization. The superscalar architecture achieves 2.5 DMIPS/MHz performance for real-time control algorithms.The EEPROM (2kB), Boot ROM (64kB) organization supports secure boot with cryptographic signature verification. Memory partitions enforce strict access privileges for enhanced software security.As part of the MEC170x family, this microcontroller shares common development tools with other members. The consistent register map simplifies software porting between variants.The 480KB memory implements ECC protection for single-error correction and double-error detection. The memory controller supports byte-addressable access for efficient data manipulation.Featuring ACPI, EBI/EMI, eSPI, I²C, LPC, PECI, PS/2, QSPI, SPI connectivity, the device includes CAN-FD controllers with 5Mbps capability. Each communication peripheral implements galvanic isolation for ground potential difference tolerance.With 148 configurable ports, the GPIO subsystem supports 8mA drive strength per pin. Programmable pull-up/pull-down resistors eliminate external components in typical designs.Operating from 1.71V ~ 3.465V inputs, the power management unit includes load-dump protection up to 40V. The integrated voltage supervisors ensure proper brown-out recovery sequences.Rated for -40°C ~ 85°C (TA) operation, the device employs silicon-on-sapphire technology for improved thermal characteristics. The package design minimizes thermal resistance to the PCB.The Surface Mount configuration supports conformal coating for humidity resistance. Solder joints are designed for thermal cycling reliability exceeding 1000 cycles (-40 C to +125 C).The 169-WFBGA option features wettable flank plating for automated optical inspection. Package dimensions comply with automotive PCB spacing requirements.Available in 169-WFBGA (11x11) format, each unit undergoes extended life testing. The manufacturing flow includes 100% electrical testing at temperature extremes.