MDT275E01001

Amphenol ICC (FCI)

General info

Part Number

MDT275E01001

Manufacturer

Amphenol ICC (FCI)

Description:

CONN M.2 FMALE 67POS 0.020 GOLD

Datasheet:

MDT275E01001 PDF

Reference Price (USD)

$2.40000

500+

$2.376

1000+

$2.352

1500+

$2.328

2000+

$2.304

2500+

$2.28

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

MDT275E01001

$2.40

Product details

Amphenol ICC (FCI)'s MDT275E01001 represents a breakthrough in Card Edge Connectors - Edgeboard Connectors technology for next-generation systems. Optimized for high-speed digital interfaces, this connector combines superior electrical performance with ruggedized construction for demanding applications.Supporting M.2 (NGFF) Mini Card standards, the connector features adaptive contact geometry. This innovative design automatically compensates for card thickness variations up to 0.015" during insertion.The Female configuration incorporates patented contact protection. When unmated, spring-loaded shutters prevent contamination ingress, meeting IP67 requirements when properly panel-mounted.The 67 total contacts support parallel bus architectures. Each contact path is individually tuned to maintain characteristic impedance within 5% of nominal value.The 2 row arrangement incorporates ground contacts between signal pairs. This configuration provides 30 controlled impedance for high-speed differential signals.The 0.020" (0.50mm) pitch design enables 28Gbps NRZ signaling. Precision-molded dielectric spacers maintain consistent propagation velocity across all contact pairs.Dual readout capability supports advanced diagnostic monitoring. Integrated test points allow in-circuit verification without disassembly.The Board Lock, Keyed package includes EMI gaskets and grounding clips. These options reduce common-mode noise by 18dB in 1-6GHz frequency range.Surface Mount, Right Angle installation features anti-walk pegs. These positive retention features prevent connector movement during vibration per MIL-STD-810G Method 514.7.The Solder method creates metallurgical bonds without thermal degradation. Process controls maintain peak reflow temperatures below 260 C for lead-free assembly compatibility.Copper Alloy contacts exhibit exceptional stress relaxation resistance. After 1,000 hours at 125 C, contact force remains within 90% of initial value.The Gold surface treatment provides superior corrosion resistance. Salt spray testing per ASTM B117 shows no degradation after 500 hours exposure.With 30.0µin (0.76µm) plating, the contacts achieve <5m insertion resistance. This specification supports power delivery up to 3A per contact.The Black housing material includes halogen-free flame retardants. Compliant with UL94 V-0 requirements, it prevents flame propagation in vertical burn tests.Rated for -40°C ~ 80°C, the connector uses thermally matched materials. Coefficient of thermal expansion (CTE) is controlled within 12ppm/ C to prevent thermal cycling failures.