MCIMX7S3EVK08SD
NXP USA Inc.
MCIMX7S3EVK08SD
NXP USA Inc.
I.MX 7SOLO: REV 1.3
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$24.00717
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$23.7670983
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$23.5270266
1500+
$23.2869549
2000+
$23.0468832
2500+
$22.8068115
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MCIMX7S3EVK08SD
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Product details
The MCIMX7S3EVK08SD by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A7, ARM® Cortex®-M4 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 800MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Multimedia; NEON™ MPE neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The LPDDR2, LPDDR3, DDR3, DDR3L memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting Keypad, LCD, MIPI outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.10/100/1000Mbps (1) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 1.8V, 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -20°C ~ 105°C (TJ) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS include model encryption and secure model update mechanisms for protected edge AI deployments.The 488-TFBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 488-TFBGA (12x12), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: Keypad, LCD, MIPI
- Ethernet: 10/100/1000Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
- Voltage - I/O: 1.8V, 3.3V
- Operating Temperature: -20°C ~ 105°C (TJ)
- Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
- Package / Case: 488-TFBGA
- Supplier Device Package: 488-TFBGA (12x12)
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