MCIMX6Y2CVM08AB
NXP USA Inc.
MCIMX6Y2CVM08AB
NXP USA Inc.
I.MX6ULL ROM PERF ENHAN
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$18.6434
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MCIMX6Y2CVM08AB
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Product details
The MCIMX6Y2CVM08AB by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A7 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 792MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Multimedia; NEON™ MPE neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The LPDDR2, DDR3, DDR3L memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting Electrophoretic, LCD outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.10/100Mbps (1) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 OTG + PHY (2) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 1.8V, 2.8V, 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -40°C ~ 105°C (TJ) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented A-HAB, ARM TZ, CSU, SJC, SNVS include model encryption and secure model update mechanisms for protected edge AI deployments.The 289-LFBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 289-MAPBGA (14x14), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A7
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 792MHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: LPDDR2, DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: Electrophoretic, LCD
- Ethernet: 10/100Mbps (1)
- SATA: -
- USB: USB 2.0 OTG + PHY (2)
- Voltage - I/O: 1.8V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
- Package / Case: 289-LFBGA
- Supplier Device Package: 289-MAPBGA (14x14)
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