MCIMX6X3CVN08AC

The MCIMX6X3CVN08AC from NXP USA Inc. represents cutting-edge technology in the Embedded - Microprocessors segment, engineered for mission-critical embedded applications. This high-performance microprocessor combines robust architecture with advanced signal processing capabilities, delivering unparalleled computational density for next-generation IoT edge devices.Featuring an ARM® Cortex®-A9, ARM® Cortex®-M4 core, this microprocessor achieves optimal balance between power efficiency and processing throughput, making it ideal for real-time signal processing applications where deterministic latency is crucial.With 2 Core, 32-Bit configuration, the device enables parallel processing of complex algorithms while maintaining efficient power distribution across the silicon die.Operating at 200MHz, 800MHz, the processor delivers clock-synchronized performance that meets stringent timing requirements for industrial automation systems and robotic control applications.Enhanced by Multimedia; NEON™ MPE co-processing units, the microprocessor delivers specialized performance for digital signal processing and cryptographic operations.The integrated LPDDR2, LVDDR3, DDR3 memory controllers provide low-latency access to high-bandwidth memory, essential for data-intensive applications like computer vision and machine learning inference.Yes graphics support enables the processor to handle sophisticated human-machine interfaces without compromising system responsiveness or power budgets.Multiple display options including Keypad, LCD ensure compatibility with diverse HMI configurations, from industrial panels to automotive infotainment systems.10/100/1000Mbps (2) networking capabilities provide robust connectivity for industrial IoT deployments, supporting deterministic Ethernet protocols for real-time control systems.The USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) interfaces offer flexible peripheral connectivity options, engineered to meet USB-IF compliance standards for reliable data transfer in harsh environments.Designed with 1.8V, 2.5V, 2.8V, 3.15V tolerant I/Os, the device demonstrates exceptional signal integrity across varying voltage domains in mixed-signal embedded systems.Rated for -40°C ~ 105°C (TA) operation, this microprocessor maintains clock synchronization stability even under extreme thermal conditions encountered in automotive underhood applications.Advanced A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE ensure secure boot processes and runtime protection, meeting stringent cybersecurity requirements for networked industrial equipment.The 400-LFBGA package configuration optimizes thermal dissipation while minimizing PCB footprint, crucial for space-constrained embedded designs.Available in 400-MAPBGA (17x17), the device offers multiple packaging options to accommodate different manufacturing processes and assembly requirements.