MCIMX6L7DVN10AC
NXP Semiconductors
MCIMX6L7DVN10AC
NXP Semiconductors
MCIMX6L - I.MX 6 SERIES 32-BIT M
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$17.43059
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$17.2562841
1000+
$17.0819782
1500+
$16.9076723
2000+
$16.7333664
2500+
$16.5590605
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MCIMX6L7DVN10AC
$17.43
Product details
NXP Semiconductors's MCIMX6L7DVN10AC revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The ARM® Cortex®-A9 core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 1 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 1GHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.The Multimedia; NEON™ SIMD units accelerate OFDM processing and channel coding algorithms.High-bandwidth DDR3, LPDDR2 memory interfaces support the massive data flows characteristic of 5G signal processing.Yes graphics capabilities enable visualization of network performance metrics in real-time.The LCD interfaces support remote management consoles for network equipment.10/100Mbps (1) implementations provide the necessary throughput for CPRI and eCPRI interfaces in 5G radios.USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1) interfaces enable flexible configuration and debugging of network equipment during deployment.1.2V, 1.8V, 3V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for 0°C ~ 95°C (TJ) operation, the processor maintains performance in outdoor radio unit installations.Carrier-grade ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection protect network infrastructure from both physical and cyber threats.The 432-TFBGA package design optimizes thermal performance for continuous high-load operation.Available in 432-MAPBGA (13x13), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1GHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: DDR3, LPDDR2
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD
- Ethernet: 10/100Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1)
- Voltage - I/O: 1.2V, 1.8V, 3V
- Operating Temperature: 0°C ~ 95°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 432-TFBGA
- Supplier Device Package: 432-MAPBGA (13x13)
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