MCIMX6L3EVN10AC
NXP USA Inc.
MCIMX6L3EVN10AC
NXP USA Inc.
I.MX 6SL ROM PERF ENHAN
Reference Price (USD)
1+
$28.78880
500+
$28.500912
1000+
$28.213024
1500+
$27.925136
2000+
$27.637248
2500+
$27.34936
Exquisite packaging
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MCIMX6L3EVN10AC
$28.79
Product details
The MCIMX6L3EVN10AC from NXP USA Inc. delivers military-grade reliability in the Embedded - Microprocessors category, hardened for aerospace and defense applications. This radiation-hardened microprocessor combines triple-modular redundancy with error-correcting architectures, meeting MIL-STD-883 requirements for mission-critical systems.Featuring a ARM® Cortex®-A9 radiation-hardened core, the processor implements lockstep execution with cycle-by-cycle comparison for fault detection.The 1 Core, 32-Bit configuration includes redundant execution units for single-event upset mitigation in space applications.Operating at 1.0GHz, the device meets the real-time processing requirements of spacecraft attitude control systems.The Multimedia; NEON™ SIMD units include radiation-hardened floating-point accelerators for spacecraft navigation.LPDDR2, LVDDR3, DDR3 memory interfaces incorporate SECDED ECC protection for single-event upset mitigation in orbit.Yes display controllers include radiation-hardened frame buffers for critical spacecraft displays.The Keypad, LCD interfaces implement MIL-STD-1553 protocol support for aerospace databuses.10/100Mbps (1) implementations include space-grade PHYs with enhanced EMI characteristics for spacecraft applications.The USB 2.0 + PHY (3) interfaces meet MIL-STD-1275 requirements for military vehicle power environments.1.2V, 1.8V, 3.0V tolerant I/Os withstand transient voltage spikes common in military electrical systems.Qualified for -40°C ~ 105°C (TA) operation, the processor functions in extreme space and high-altitude environments.Military-grade ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection include TEMPEST-approved cryptographic modules for secure communications.The 432-TFBGA package implements hermetic sealing for protection against moisture and contaminants.Available in 432-MAPBGA (13x13), the device supports military-grade PCB assembly processes.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (3)
- Voltage - I/O: 1.2V, 1.8V, 3.0V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 432-TFBGA
- Supplier Device Package: 432-MAPBGA (13x13)
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