MCIMX6L3EVN10AB
NXP USA Inc.
MCIMX6L3EVN10AB
NXP USA Inc.
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Reference Price (USD)
1+
$35.14000
500+
$34.7886
1000+
$34.4372
1500+
$34.0858
2000+
$33.7344
2500+
$33.383
Exquisite packaging
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MCIMX6L3EVN10AB
$35.14
Product details
The MCIMX6L3EVN10AB from NXP USA Inc. delivers automotive-grade performance in the Embedded - Microprocessors segment, developed for next-generation vehicle electronics. This AEC-Q100 qualified microprocessor combines functional safety features with high computational density, meeting stringent automotive reliability requirements.Based on the ARM® Cortex®-A9 architecture, the processor delivers ASIL-D compliant performance for safety-critical automotive applications.The 1 Core, 32-Bit configuration provides redundant processing paths required for fault-tolerant automotive systems.With operating speeds up to 1.0GHz, the device meets the real-time requirements of advanced driver assistance systems (ADAS).The Multimedia; NEON™ SIMD units accelerate sensor fusion algorithms required for autonomous driving systems.Automotive-grade LPDDR2, LVDDR3, DDR3 memory interfaces include ECC protection for enhanced data reliability in safety-critical systems.Yes graphics support enables rendering of high-resolution instrument clusters and head-up displays.The Keypad, LCD interfaces support automotive display standards with enhanced EMI characteristics.10/100Mbps (1) implementations provide the backbone for automotive Ethernet networks supporting time-sensitive applications.USB 2.0 + PHY (3) interfaces meet automotive USB standards for reliable connectivity with in-vehicle infotainment systems.1.2V, 1.8V, 3.0V tolerant I/Os ensure reliable operation across the automotive voltage range.Qualified for -40°C ~ 105°C (TA) operation, the processor functions reliably in extreme automotive environments.Automotive-specific ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection protect against both remote and physical attacks on vehicle systems.The 432-TFBGA package meets automotive reliability standards for thermal cycling and mechanical stress.Available in 432-MAPBGA (13x13), the device supports automotive PCB assembly processes.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (3)
- Voltage - I/O: 1.2V, 1.8V, 3.0V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 432-TFBGA
- Supplier Device Package: 432-MAPBGA (13x13)
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