MCIMX6L2EVN10ACR
NXP USA Inc.
MCIMX6L2EVN10ACR
NXP USA Inc.
I.MX 6SL ROM PERF ENHAN
Reference Price (USD)
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$27.55180
500+
$27.276282
1000+
$27.000764
1500+
$26.725246
2000+
$26.449728
2500+
$26.17421
Exquisite packaging
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MCIMX6L2EVN10ACR
$27.55
Product details
The MCIMX6L2EVN10ACR by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A9 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 1.0GHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Multimedia; NEON™ SIMD neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The LPDDR2, LVDDR3, DDR3 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.Yes GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting Keypad, LCD outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.10/100Mbps (1) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 + PHY (3) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 1.2V, 1.8V, 3.0V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -40°C ~ 105°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection include model encryption and secure model update mechanisms for protected edge AI deployments.The 432-TFBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 432-MAPBGA (13x13), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (3)
- Voltage - I/O: 1.2V, 1.8V, 3.0V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 432-TFBGA
- Supplier Device Package: 432-MAPBGA (13x13)
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