MCIMX535DVV1C
NXP USA Inc.
MCIMX535DVV1C
NXP USA Inc.
IC MPU I.MX53 1.0GHZ 529TEBGA-2
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Product details
The MCIMX535DVV1C from NXP USA Inc. delivers military-grade reliability in the Embedded - Microprocessors category, hardened for aerospace and defense applications. This radiation-hardened microprocessor combines triple-modular redundancy with error-correcting architectures, meeting MIL-STD-883 requirements for mission-critical systems.Featuring a ARM® Cortex®-A8 radiation-hardened core, the processor implements lockstep execution with cycle-by-cycle comparison for fault detection.The 1 Core, 32-Bit configuration includes redundant execution units for single-event upset mitigation in space applications.Operating at 1.0GHz, the device meets the real-time processing requirements of spacecraft attitude control systems.The Multimedia; NEON™ SIMD units include radiation-hardened floating-point accelerators for spacecraft navigation.LPDDR2, DDR2, DDR3 memory interfaces incorporate SECDED ECC protection for single-event upset mitigation in orbit.Yes display controllers include radiation-hardened frame buffers for critical spacecraft displays.The Keypad, LCD interfaces implement MIL-STD-1553 protocol support for aerospace databuses.10/100Mbps (1) implementations include space-grade PHYs with enhanced EMI characteristics for spacecraft applications.SATA 1.5Gbps (1) interfaces implement error-correcting protocols for reliable data storage in radiation environments.The USB 2.0 (2), USB 2.0 + PHY (2) interfaces meet MIL-STD-1275 requirements for military vehicle power environments.1.3V, 1.8V, 2.775V, 3.3V tolerant I/Os withstand transient voltage spikes common in military electrical systems.Qualified for -20°C ~ 85°C (TC) operation, the processor functions in extreme space and high-altitude environments.Military-grade ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection include TEMPEST-approved cryptographic modules for secure communications.The 529-FBGA package implements hermetic sealing for protection against moisture and contaminants.Available in 529-FBGA (19x19), the device supports military-grade PCB assembly processes.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM® Cortex®-A8
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, DDR2, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100Mbps (1)
- SATA: SATA 1.5Gbps (1)
- USB: USB 2.0 (2), USB 2.0 + PHY (2)
- Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
- Operating Temperature: -20°C ~ 85°C (TC)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 529-FBGA
- Supplier Device Package: 529-FBGA (19x19)
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