MCIMX534AVV8C2R2
NXP USA Inc.
MCIMX534AVV8C2R2
NXP USA Inc.
IMX53 REV 2.1 AUTO
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Product details
NXP USA Inc.'s MCIMX534AVV8C2R2 revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The ARM® Cortex®-A8 core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 1 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 800MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.The Multimedia; NEON™ SIMD units accelerate OFDM processing and channel coding algorithms.High-bandwidth LPDDR2, DDR2, DDR3 memory interfaces support the massive data flows characteristic of 5G signal processing.Yes graphics capabilities enable visualization of network performance metrics in real-time.The Keypad, LCD interfaces support remote management consoles for network equipment.10/100Mbps (1) implementations provide the necessary throughput for CPRI and eCPRI interfaces in 5G radios.SATA 1.5Gbps (1) interfaces provide local storage for network configuration and performance logging.USB 2.0 (2), USB 2.0 + PHY (2) interfaces enable flexible configuration and debugging of network equipment during deployment.1.3V, 1.8V, 2.775V, 3.3V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for -40°C ~ 125°C (TJ) operation, the processor maintains performance in outdoor radio unit installations.Carrier-grade ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection protect network infrastructure from both physical and cyber threats.The 529-FBGA package design optimizes thermal performance for continuous high-load operation.Available in 529-FBGA (19x19), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM® Cortex®-A8
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, DDR2, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100Mbps (1)
- SATA: SATA 1.5Gbps (1)
- USB: USB 2.0 (2), USB 2.0 + PHY (2)
- Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 529-FBGA
- Supplier Device Package: 529-FBGA (19x19)
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