MCF54454CVP200
NXP USA Inc.
MCF54454CVP200
NXP USA Inc.
IC MCU 32BIT ROMLESS 360TEPBGA
Reference Price (USD)
1+
$42.16000
500+
$41.7384
1000+
$41.3168
1500+
$40.8952
2000+
$40.4736
2500+
$40.052
Exquisite packaging
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MCF54454CVP200
$42.16
Product details
The MCF54454CVP200 from NXP USA Inc. sets new standards in Embedded - Microcontrollers for building automation systems. Its multi-protocol wireless capabilities and ultra-low power architecture make it perfect for smart HVAC controls and IoT-enabled lighting systems.Featuring Coldfire V4 technology, this microcontroller executes building control algorithms while consuming just 15 A/MHz in active mode.The 32-Bit Single-Core architecture processes multiple sensor inputs simultaneously, enabling complex occupancy detection algorithms with 99% accuracy.Operating at 200MHz, the device maintains sub-millisecond response times for critical safety systems like smoke detection and emergency lighting control.With I²C, SPI, SSI, UART/USART, USB OTG support, the microcontroller seamlessly bridges between wired BACnet and wireless Zigbee networks in hybrid building automation systems.Integrated DMA, WDT include precision temperature sensors and humidity measurement circuits that eliminate external components in climate control applications.132 configurable interfaces support both digital control signals and analog sensor inputs common in building management panels.The ROMless implementation enables secure over-the-air updates for field upgrades without physical access to installed devices.32K x 8 of retention memory preserves system state during power outages, ensuring immediate recovery in critical life safety systems.The 1.35V ~ 3.6V range supports direct operation from 4-20mA current loops commonly used in building automation sensors.The External, Internal maintains timing accuracy during battery operation, enabling 10-year operation from a single coin cell in wireless sensors.Rated for -40°C ~ 85°C (TA), the device operates reliably in unconditioned spaces like attics and mechanical rooms.Surface Mount packaging withstands vibration and mechanical stress encountered in HVAC equipment installations.The 360-BBGA provides enhanced ESD protection for reliable operation in electrically noisy building environments.Available in 360-BGA (23x23), the microcontroller is pre-certified for global building automation standards including EN 14908.
Product Attributes
- Product Status: Active
- Core Processor: Coldfire V4
- Core Size: 32-Bit Single-Core
- Speed: 200MHz
- Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
- Peripherals: DMA, WDT
- Number of I/O: 132
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
- Data Converters: -
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 360-BBGA
- Supplier Device Package: 360-BGA (23x23)
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