MCF54452VR266R

NXP USA Inc.

General info

Part Number

MCF54452VR266R

Manufacturer

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 360TEPBGA

Datasheet:

MCF54452VR266R PDF MCF54452VR266R Datasheet

Reference Price (USD)

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MCF54452VR266R

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Product details

Designed for industrial IoT applications, the MCF54452VR266R by NXP USA Inc. redefines performance in Embedded - Microcontrollers. Its ultra-low power architecture and robust RF coexistence capabilities make it ideal for wireless sensor networks in smart factory environments.The Coldfire V4 core implements dynamic voltage scaling that reduces active power by 40% compared to fixed-voltage designs, extending battery life in remote monitoring nodes.A 32-Bit Single-Core architecture with single-cycle multiply-accumulate units accelerates FFT computations for vibration analysis in predictive maintenance applications.Operating at 266MHz with <1 A/MHz active current, the microcontroller delivers the perfect balance between performance and energy efficiency for energy-harvesting applications.The I²C, SPI, SSI, UART/USART, USB OTG interfaces incorporate galvanic isolation support, enabling direct connection to industrial fieldbus networks without external isolation components.DMA, WDT include advanced security features like cryptographic accelerators and true random number generators, protecting industrial equipment from cyber threats.With 132 programmable as either digital or analog interfaces, the device can directly interface with diverse industrial sensors including 4-20mA loops.The ROMless implementation supports live firmware updates with rollback protection, ensuring uninterrupted operation during field upgrades.32K x 8 of retention RAM maintains context during deep sleep modes, enabling instant wake-up response to critical process events.The 1.35V ~ 3.6V range supports direct powering from industrial 24V DC supplies through simple resistive dividers, simplifying power architecture.The Internal design maintains 0.25% frequency accuracy for wireless protocol timing, eliminating the need for external crystal components in space-constrained designs.Rated for 0°C ~ 70°C (TA), the device operates reliably in foundry environments where ambient temperatures can fluctuate rapidly.Surface Mount packaging withstands repeated thermal shock from -40 C to 125 C, meeting reliability requirements for outdoor industrial installations.The 360-BBGA format provides 8kV ESD protection on all pins, surviving electrostatic discharges common in plastic injection molding facilities.Available in 360-TEPBGA (23x23), the microcontroller supports industrial-grade qualification including 1000-hour HTOL testing at 125 C.