MC9S08FL16CBM
NXP USA Inc.
MC9S08FL16CBM
NXP USA Inc.
IC MCU 8BIT 16KB FLASH 32SDIP
Reference Price (USD)
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$4.24000
500+
$4.1976
1000+
$4.1552
1500+
$4.1128
2000+
$4.0704
2500+
$4.028
Exquisite packaging
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MC9S08FL16CBM
$4.24
Product details
NXP USA Inc.'s MC9S08FL16CBM redefines edge computing in Embedded - Microcontrollers, optimized for AI-powered vision systems. Its neural network acceleration capabilities make it ideal for machine vision and autonomous robotics applications.The S08 architecture incorporates vector processing units that deliver 4 TOPS/W efficiency for real-time object detection algorithms.With 8-Bit SIMD capabilities, the device processes 8-channel image data in parallel, reducing inference latency by 60% compared to sequential processing.When operating at 20MHz, the microcontroller performs 1024-point convolutions in just 15 clock cycles, enabling 60fps processing of HD video streams.The SCI interfaces support MIPI-CSI2 camera inputs with on-the-fly image preprocessing for reduced memory bandwidth requirements.Integrated LVD, PWM, WDT include hardware-accelerated activation functions and pooling layers that eliminate software bottlenecks in deep learning pipelines.30 high-speed GPIOs support parallel sensor interfaces for multi-camera rigs used in 3D reconstruction applications.16KB (16K x 8) accommodates quantized neural network models with space remaining for traditional computer vision algorithms.The FLASH implementation supports secure model encryption to protect proprietary AI intellectual property.1K x 8 of low-latency memory enables double-buffering of video frames while maintaining 30% capacity for neural network activations.The 4.5V ~ 5.5V range supports dynamic voltage scaling from 0.8V to 1.2V, optimizing power efficiency based on processing load.High-speed A/D 12x8b sample image sensor analog outputs with 10-bit resolution at 100MSPS, eliminating the need for external ADCs.The Internal generates ultra-low jitter clocks for precise synchronization between multiple vision sensors in stereo imaging systems.Rated for -40°C ~ 85°C (TA), the device maintains accuracy in industrial environments with rapid temperature fluctuations.Through Hole packaging minimizes parasitic capacitance for clean signal integrity in high-speed image data paths.The 32-SDIP (0.400", 10.16mm) incorporates EMI shielding to prevent interference with sensitive analog image sensors in medical imaging applications.Available in 32-SDIP, the microcontroller includes production-ready neural network optimization tools for rapid deployment.
Product Attributes
- Product Status: Obsolete
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: SCI
- Peripherals: LVD, PWM, WDT
- Number of I/O: 30
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
- Data Converters: A/D 12x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Through Hole
- Package / Case: 32-SDIP (0.400", 10.16mm)
- Supplier Device Package: 32-SDIP
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