MC68HC705J1ACPE
NXP USA Inc.
MC68HC705J1ACPE
NXP USA Inc.
IC MCU 8BIT 1.2KB OTP 20DIP
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Product details
NXP USA Inc.'s MC68HC705J1ACPE sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The HC05 core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 8-Bit processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 4MHz, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.The comprehensive POR, WDT suite includes automotive-specific features like crank-angle measurement interfaces and injector drive timers, reducing external component count in engine management systems.14 programmable interfaces support mixed-voltage operation from 1.8V to 5V, simplifying integration with legacy automotive sensors and actuators.1.2KB (1.2K x 8) of fault-tolerant storage accommodates ASIL-D compliant software architectures with dual-core lockstep implementation for functional safety.The OTP implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.64 x 8 of parity-protected memory prevents data corruption from alpha particle strikes, meeting ISO 26262 requirements for safety-critical storage.An automotive-grade 3V ~ 5.5V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.Internal clocking architecture maintains <50ppm frequency stability across the entire automotive temperature range, ensuring reliable CAN bus timing.Qualified for -40°C ~ 85°C (TA), the device operates reliably in dashboard locations where ambient temperatures can exceed 85 C during summer conditions.The Through Hole option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.20-DIP (0.300", 7.62mm) packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.Available in 20-DIP, the microcontroller supports AEC-Q100 Grade 1 qualification for deployment in safety-relevant automotive systems.
Product Attributes
- Product Status: Obsolete
- Core Processor: HC05
- Core Size: 8-Bit
- Speed: 4MHz
- Connectivity: -
- Peripherals: POR, WDT
- Number of I/O: 14
- Program Memory Size: 1.2KB (1.2K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 64 x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Through Hole
- Package / Case: 20-DIP (0.300", 7.62mm)
- Supplier Device Package: 20-DIP
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