MC68302CRC20C157
Freescale Semiconductor
MC68302CRC20C157
Freescale Semiconductor
INTEGRATED MULTIPROTOCOL MICROPR
Reference Price (USD)
1+
$168.27000
500+
$166.5873
1000+
$164.9046
1500+
$163.2219
2000+
$161.5392
2500+
$159.8565
Exquisite packaging
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MC68302CRC20C157
$168.27
Product details
The MC68302CRC20C157 from Freescale Semiconductor represents cutting-edge technology in the Embedded - Microprocessors segment, engineered for mission-critical embedded applications. This high-performance microprocessor combines robust architecture with advanced signal processing capabilities, delivering unparalleled computational density for next-generation IoT edge devices.Featuring an M68000 core, this microprocessor achieves optimal balance between power efficiency and processing throughput, making it ideal for real-time signal processing applications where deterministic latency is crucial.With 1 Core, 8-Bit, 16-Bit configuration, the device enables parallel processing of complex algorithms while maintaining efficient power distribution across the silicon die.Operating at 20MHz, the processor delivers clock-synchronized performance that meets stringent timing requirements for industrial automation systems and robotic control applications.Enhanced by Communications; RISC CPM co-processing units, the microprocessor delivers specialized performance for digital signal processing and cryptographic operations.The integrated DRAM memory controllers provide low-latency access to high-bandwidth memory, essential for data-intensive applications like computer vision and machine learning inference.No graphics support enables the processor to handle sophisticated human-machine interfaces without compromising system responsiveness or power budgets.Designed with 5V tolerant I/Os, the device demonstrates exceptional signal integrity across varying voltage domains in mixed-signal embedded systems.Rated for -40°C ~ 85°C (TA) operation, this microprocessor maintains clock synchronization stability even under extreme thermal conditions encountered in automotive underhood applications.The 132-BFPGA package configuration optimizes thermal dissipation while minimizing PCB footprint, crucial for space-constrained embedded designs.Available in 132-PGA (39.63x39.63), the device offers multiple packaging options to accommodate different manufacturing processes and assembly requirements.
Product Attributes
- Product Status: Active
- Core Processor: M68000
- Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
- Speed: 20MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 5V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: -
- Package / Case: 132-BFPGA
- Supplier Device Package: 132-PGA (39.63x39.63)
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