M2S150-1FCG1152
Microchip Technology
M2S150-1FCG1152
Microchip Technology
IC SOC CORTEX-M3 166MHZ 1152BGA
Reference Price (USD)
1+
$447.82917
500+
$443.3508783
1000+
$438.8725866
1500+
$434.3942949
2000+
$429.9160032
2500+
$425.4377115
Exquisite packaging
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M2S150-1FCG1152
$447.83
Product details
The M2S150-1FCG1152 by Microchip Technology is a breakthrough in Embedded - System On Chip (SoC), designed for ultra-low-power IoT edge devices. This SoC combines energy-efficient processing with advanced sleep modes, making it perfect for battery-powered applications where power consumption and signal integrity are crucial for extended operational life.Utilizing a MCU, FPGA architecture, the device achieves unprecedented power efficiency while maintaining reliable data throughput for sensor fusion applications.The ARM® Cortex®-M3 core delivers optimal performance-per-watt ratios, enabling complex edge AI computations within tight energy budgets.512KB of flash memory provides sufficient storage for machine learning models and over-the-air update capabilities in remote deployments.With 64KB of ultra-low-leakage RAM, the processor maintains data retention during deep sleep modes critical for energy harvesting systems.Integrated DDR, PCIe, SERDES include precision ADCs and wireless interfaces that eliminate the need for external components in compact designs.The CANbus, Ethernet, I²C, SPI, UART/USART, USB options support both short-range and LPWAN protocols, ensuring seamless integration into diverse IoT ecosystems.Operating at 166MHz, the processor balances performance with power efficiency for always-on sensing applications.FPGA - 150K Logic Modules feature hardware-accelerated encryption engines that secure device-to-cloud communications without compromising battery life.Rated for 0°C ~ 85°C (TJ), the component maintains reliable operation in extreme environmental monitoring applications.The 1152-BBGA, FCBGA package enables ultra-compact designs while providing robust thermal characteristics.Available in 1152-FCBGA (35x35), the device supports automated assembly processes for high-volume IoT product manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 512KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 150K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FCBGA (35x35)
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