M2S090TS-FGG676I
Microchip Technology
M2S090TS-FGG676I
Microchip Technology
IC SOC CORTEX-M3 166MHZ 676FBGA
Reference Price (USD)
1+
$350.22475
500+
$346.7225025
1000+
$343.220255
1500+
$339.7180075
2000+
$336.21576
2500+
$332.7135125
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
M2S090TS-FGG676I
$350.22
Product details
Microchip Technology's M2S090TS-FGG676I revolutionizes Embedded - System On Chip (SoC) technology for aerospace and defense applications. Optimized for extreme environments, this radiation-hardened SoC combines fault-tolerant design with military-grade reliability, making M2S090TS-FGG676I the preferred choice for satellite systems where component longevity and single-event upset immunity are critical.The triple-redundant MCU, FPGA architecture provides SEU mitigation through continuous voting logic, ensuring uninterrupted operation in high-radiation orbits.The ARM® Cortex®-M3 core delivers space-qualified processing power with built-in error detection and correction mechanisms for mission-critical computations.512KB of radiation-tolerant flash memory provides secure storage for flight software with single-bit error correction capabilities.With 64KB of scrubbed RAM, the processor maintains data integrity even during solar flare events and other space radiation phenomena.Space-grade DDR, PCIe, SERDES include MIL-STD-1553 interfaces and spacewire controllers essential for spacecraft avionics systems.The CANbus, Ethernet, I²C, SPI, UART/USART, USB suite supports both traditional aerospace databuses and modern high-speed interconnects required for next-generation satellite payloads.Operating at 166MHz, the processor meets the real-time requirements of attitude control systems while staying within strict power budgets.FPGA - 90K Logic Modules include latch-up immune circuitry and total dose radiation hardening to 100krad(Si) for long-duration missions.Qualified for -40°C ~ 100°C (TJ), the component maintains stable operation from cryogenic space environments to sun-facing satellite surfaces.The 676-BGA package features hermetic sealing and gold-plated contacts for reliability in vacuum conditions.Available in 676-FBGA (27x27), the device meets MIL-PRF-38535 Class K requirements for space applications.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 512KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 90K Logic Modules
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)
You May Also Be Interested In
