M2S090T-FGG676
Microchip Technology
M2S090T-FGG676
Microchip Technology
IC SOC CORTEX-M3 166MHZ 676FBGA
Reference Price (USD)
1+
$280.15950
500+
$277.357905
1000+
$274.55631
1500+
$271.754715
2000+
$268.95312
2500+
$266.151525
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M2S090T-FGG676
$280.16
Product details
Engineered for next-generation automotive electronics, Microchip Technology's M2S090T-FGG676 redefines Embedded - System On Chip (SoC) performance in vehicular applications. This advanced SoC combines automotive-grade reliability with sophisticated power management, making M2S090T-FGG676 the ideal choice for ADAS systems where signal integrity and functional safety are paramount.The dual-core MCU, FPGA architecture provides redundant processing paths that meet ASIL-D requirements for autonomous driving subsystems.Featuring the ARM® Cortex®-M3, the device delivers the computational density needed for real-time sensor fusion while meeting stringent automotive power budgets.512KB of automotive-qualified flash memory ensures secure storage for machine learning models and over-the-air update packages.With 64KB of error-protected RAM, the processor maintains data coherence during sudden power fluctuations common in automotive environments.Automotive-specific DDR, PCIe, SERDES include CAN-FD controllers and automotive Ethernet MACs, reducing the need for external interface chips.The comprehensive CANbus, Ethernet, I²C, SPI, UART/USART, USB suite supports in-vehicle network topologies while providing robust EMI performance essential for automotive applications.Operating at 166MHz, the processor meets the real-time processing requirements of high-resolution radar and lidar systems.FPGA - 90K Logic Modules include hardware security modules that provide cryptographic acceleration for secure vehicle-to-cloud communications.Qualified for 0°C ~ 85°C (TJ), the component maintains precise timing references across the full automotive temperature range.The 676-BGA package features automotive-grade materials that withstand thermal shock and mechanical vibration.Available in 676-FBGA (27x27), the device meets AEC-Q100 Grade 1 requirements for automotive electronics.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 512KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 90K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)
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