M2S090S-1FGG676I
Microsemi Corporation
M2S090S-1FGG676I
Microsemi Corporation
IC SOC CORTEX-M3 166MHZ 676FBGA
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Product details
Engineered for next-generation consumer electronics, Microsemi Corporation's M2S090S-1FGG676I revolutionizes Embedded - System On Chip (SoC) performance in smart home devices. This advanced SoC combines powerful processing with intuitive user interfaces, making M2S090S-1FGG676I ideal for voice-controlled assistants where audio signal processing and low-latency response are critical.The multi-core MCU, FPGA architecture enables simultaneous voice recognition, natural language processing, and wireless communication tasks.Featuring the ARM® Cortex®-M3, the device delivers the computational power needed for real-time audio beamforming and noise cancellation algorithms.512KB of secure flash memory stores voice recognition models and user preferences with fast access times.With 64KB of low-latency RAM, the processor ensures smooth performance during complex voice interaction scenarios.Consumer-focused DDR, PCIe, SERDES include high-fidelity audio interfaces and touch controllers for seamless user experiences.The comprehensive CANbus, Ethernet, I²C, SPI, UART/USART, USB suite supports all major smart home protocols while maintaining robust wireless performance.Operating at 166MHz, the processor meets the real-time requirements of always-listening voice interfaces.FPGA - 90K Logic Modules include hardware-accelerated neural network processing for on-device AI capabilities.Rated for -40°C ~ 100°C (TJ), the component maintains reliable operation in various home environments.The 676-BGA package enables sleek, compact designs without compromising thermal performance.Available in 676-FBGA (27x27), the device supports high-volume consumer electronics manufacturing.
Product Attributes
- Product Status: Obsolete
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 512KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 90K Logic Modules
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)
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