M2S090-1FCS325I
Microchip Technology
M2S090-1FCS325I
Microchip Technology
IC SOC CORTEX-M3 166MHZ 325BGA
Reference Price (USD)
1+
$204.51756
500+
$202.4723844
1000+
$200.4272088
1500+
$198.3820332
2000+
$196.3368576
2500+
$194.291682
Exquisite packaging
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M2S090-1FCS325I
$204.52
Product details
The M2S090-1FCS325I by Microchip Technology is a breakthrough in Embedded - System On Chip (SoC), designed for ultra-low-power IoT edge devices. This SoC combines energy-efficient processing with advanced sleep modes, making it perfect for battery-powered applications where power consumption and signal integrity are crucial for extended operational life.Utilizing a MCU, FPGA architecture, the device achieves unprecedented power efficiency while maintaining reliable data throughput for sensor fusion applications.The ARM® Cortex®-M3 core delivers optimal performance-per-watt ratios, enabling complex edge AI computations within tight energy budgets.512KB of flash memory provides sufficient storage for machine learning models and over-the-air update capabilities in remote deployments.With 64KB of ultra-low-leakage RAM, the processor maintains data retention during deep sleep modes critical for energy harvesting systems.Integrated DDR, PCIe, SERDES include precision ADCs and wireless interfaces that eliminate the need for external components in compact designs.The CANbus, Ethernet, I²C, SPI, UART/USART, USB options support both short-range and LPWAN protocols, ensuring seamless integration into diverse IoT ecosystems.Operating at 166MHz, the processor balances performance with power efficiency for always-on sensing applications.FPGA - 90K Logic Modules feature hardware-accelerated encryption engines that secure device-to-cloud communications without compromising battery life.Rated for -40°C ~ 100°C (TJ), the component maintains reliable operation in extreme environmental monitoring applications.The 325-TFBGA, FCBGA package enables ultra-compact designs while providing robust thermal characteristics.Available in 325-FCBGA (11x13.5), the device supports automated assembly processes for high-volume IoT product manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 512KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 90K Logic Modules
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 325-TFBGA, FCBGA
- Supplier Device Package: 325-FCBGA (11x13.5)
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