M2S010-1VF256I
Microchip Technology
M2S010-1VF256I
Microchip Technology
IC SOC CORTEX-M3 166MHZ 256FBGA
Reference Price (USD)
1+
$49.15235
500+
$48.6608265
1000+
$48.169303
1500+
$47.6777795
2000+
$47.186256
2500+
$46.6947325
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M2S010-1VF256I
$49.15
Product details
The M2S010-1VF256I by Microchip Technology is a breakthrough in Embedded - System On Chip (SoC), designed for ultra-low-power IoT edge devices. This SoC combines energy-efficient processing with advanced sleep modes, making it perfect for battery-powered applications where power consumption and signal integrity are crucial for extended operational life.Utilizing a MCU, FPGA architecture, the device achieves unprecedented power efficiency while maintaining reliable data throughput for sensor fusion applications.The ARM® Cortex®-M3 core delivers optimal performance-per-watt ratios, enabling complex edge AI computations within tight energy budgets.256KB of flash memory provides sufficient storage for machine learning models and over-the-air update capabilities in remote deployments.With 64KB of ultra-low-leakage RAM, the processor maintains data retention during deep sleep modes critical for energy harvesting systems.Integrated DDR, PCIe, SERDES include precision ADCs and wireless interfaces that eliminate the need for external components in compact designs.The CANbus, Ethernet, I²C, SPI, UART/USART, USB options support both short-range and LPWAN protocols, ensuring seamless integration into diverse IoT ecosystems.Operating at 166MHz, the processor balances performance with power efficiency for always-on sensing applications.FPGA - 10K Logic Modules feature hardware-accelerated encryption engines that secure device-to-cloud communications without compromising battery life.Rated for -40°C ~ 100°C (TJ), the component maintains reliable operation in extreme environmental monitoring applications.The 256-LFBGA package enables ultra-compact designs while providing robust thermal characteristics.Available in 256-FPBGA (14x14), the device supports automated assembly processes for high-volume IoT product manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 10K Logic Modules
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 256-LFBGA
- Supplier Device Package: 256-FPBGA (14x14)
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