LZ550

Engineered for hyperscale data centers, ebm-papst Inc.'s LZ550 delivers unprecedented Fans - Accessories performance with its liquid-assisted cooling technology. This innovative component combines micro-jet impingement cooling with two-phase heat transfer, achieving 3x greater thermal conductivity than copper-based solutions. Its corrosion-resistant superlattice coating withstands prolonged exposure to dielectric fluids.As a next-generation Fastener, Rubber, this system features predictive failure analytics through embedded IoT sensors. The carbon nanotube-reinforced frame maintains dimensional stability at thermal loads exceeding 300W/cm .Compatible with For Fans with 4.3mm Dia Hole platforms, this solution incorporates shape-memory alloy fasteners that maintain constant pressure across -55 C to 150 C operation ranges. The laser-etched alignment markers ensure 0.1mm positioning accuracy during assembly.The 0.270" (6.86mm) geometry has been validated through computational thermal modeling to eliminate hot spots in 5G mmWave arrays. Its anisotropic thermal interface material provides directional heat spreading for optimized thermal management.