LX2122RE82029B
NXP USA Inc.
LX2122RE82029B
NXP USA Inc.
12XA72 64-BIT ARM 2GHZ CAN REV
Reference Price (USD)
1+
$506.10400
500+
$501.04296
1000+
$495.98192
1500+
$490.92088
2000+
$485.85984
2500+
$480.7988
Exquisite packaging
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LX2122RE82029B
$506.10
Product details
The LX2122RE82029B from NXP USA Inc. delivers military-grade reliability in the Embedded - Microprocessors category, hardened for aerospace and defense applications. This radiation-hardened microprocessor combines triple-modular redundancy with error-correcting architectures, meeting MIL-STD-883 requirements for mission-critical systems.Featuring a ARM® Cortex®-A72 radiation-hardened core, the processor implements lockstep execution with cycle-by-cycle comparison for fault detection.The 12 Core, 64-Bit configuration includes redundant execution units for single-event upset mitigation in space applications.Operating at 2GHz, the device meets the real-time processing requirements of spacecraft attitude control systems.DDR4, SDRAM memory interfaces incorporate SECDED ECC protection for single-event upset mitigation in orbit.No display controllers include radiation-hardened frame buffers for critical spacecraft displays.SATA 6Gbps (4) interfaces implement error-correcting protocols for reliable data storage in radiation environments.The USB 3.0 (1) interfaces meet MIL-STD-1275 requirements for military vehicle power environments.Qualified for 5°C ~ 105°C (TA) operation, the processor functions in extreme space and high-altitude environments.The 1150-FBGA package implements hermetic sealing for protection against moisture and contaminants.Available in 1150-FBGA (23x23), the device supports military-grade PCB assembly processes.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 12 Core, 64-Bit
- Speed: 2GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR4, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: SATA 6Gbps (4)
- USB: USB 3.0 (1)
- Voltage - I/O: -
- Operating Temperature: 5°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1150-FBGA
- Supplier Device Package: 1150-FBGA (23x23)
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