LS102MASN7EHA
NXP USA Inc.
LS102MASN7EHA
NXP USA Inc.
IC PROCESSOR DUAL CORE
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Product details
NXP USA Inc.'s LS102MASN7EHA revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The ARM1136JF-S core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 2 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 650MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.High-bandwidth DDR2 memory interfaces support the massive data flows characteristic of 5G signal processing.No graphics capabilities enable visualization of network performance metrics in real-time.GbE (2) implementations provide the necessary throughput for CPRI and eCPRI interfaces in 5G radios.USB 2.0 + PHY (1) interfaces enable flexible configuration and debugging of network equipment during deployment.Rated for 0°C ~ 70°C (TA) operation, the processor maintains performance in outdoor radio unit installations.The 448-FBGA Exposed Pad package design optimizes thermal performance for continuous high-load operation.Available in 448-PBGA w/Heat Spreader (23x23), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM1136JF-S
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 650MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: GbE (2)
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 448-FBGA Exposed Pad
- Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)
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