LS1020ASE7HNB
NXP USA Inc.
LS1020ASE7HNB
NXP USA Inc.
LS1 32BIT ARM SOC 800MHZ DDR3/
Reference Price (USD)
1+
$57.07679
500+
$56.5060221
1000+
$55.9352542
1500+
$55.3644863
2000+
$54.7937184
2500+
$54.2229505
Exquisite packaging
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LS1020ASE7HNB
$57.08
Product details
NXP USA Inc.'s LS1020ASE7HNB sets new benchmarks in the Embedded - Microprocessors market segment, optimized for compute-intensive embedded applications. This system-on-chip solution integrates advanced processing cores with sophisticated power management, delivering exceptional performance-per-watt characteristics for energy-conscious designs.The ARM® Cortex®-A7 architecture provides deterministic execution of real-time tasks while maintaining low power consumption, making it particularly suitable for battery-powered edge computing devices.Architected with 2 Core, 32-Bit capability, the processor enables efficient task partitioning and memory bandwidth utilization in multi-threaded applications.With clock speeds up to 800MHz, the device meets the computational demands of advanced motor control algorithms and power conversion systems.The Multimedia; NEON™ SIMD acceleration units significantly enhance performance for matrix operations common in AI inference tasks.Support for DDR3L, DDR4 memory technologies allows designers to optimize system cost and performance for specific application requirements.GbE (3) connectivity options provide the necessary bandwidth for industrial communication protocols including EtherCAT and PROFINET.SATA 3Gbps (1) implementations provide reliable mass storage connectivity for data acquisition systems requiring high-capacity local storage.USB 2.0 (1), USB 3.0 + PHY implementations adhere to the latest USB standards, ensuring backward compatibility while supporting high-speed data transfers.Qualified for 0°C ~ 105°C operation, the processor reliably functions in outdoor telecommunications equipment and base station applications.Comprehensive Secure Boot, TrustZone® protect against both physical and network-based attacks, crucial for financial terminals and secure access systems.The 525-FBGA, FCBGA package design incorporates advanced thermal management features for reliable operation in confined spaces.Offered in 525-FCPBGA (19x19), the device supports both conventional and advanced PCB assembly techniques.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A7
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: DDR3L, DDR4
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: GbE (3)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 (1), USB 3.0 + PHY
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 105°C
- Security Features: Secure Boot, TrustZone®
- Package / Case: 525-FBGA, FCBGA
- Supplier Device Package: 525-FCPBGA (19x19)
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