LS101MASE7EHA
NXP USA Inc.
Product details
The LS101MASE7EHA by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM1136JF-S neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 650MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The DDR2 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.GbE (2) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 + PHY (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Rated for 0°C ~ 70°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.The 448-FBGA Exposed Pad package incorporates advanced heat spreading technology for sustained AI workloads.Available in 448-PBGA w/Heat Spreader (23x23), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM1136JF-S
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 650MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: GbE (2)
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 448-FBGA Exposed Pad
- Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)