LS101MASE7DFA
NXP USA Inc.
LS101MASE7DFA
NXP USA Inc.
IC PROCESSOR DUAL CORE
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Product details
NXP USA Inc.'s LS101MASE7DFA redefines power efficiency in the Embedded - Microprocessors segment, crafted for energy-harvesting IoT endpoints. This ultra-low-power microprocessor combines near-threshold voltage operation with intelligent power gating, achieving microampere-level standby currents for decade-long battery life in wireless sensor nodes.The ARM1136JF-S ultra-low-power core maintains full register retention at subthreshold voltages, enabling seamless operation from energy harvesting sources.Designed with 1 Core, 32-Bit configuration, the processor optimizes power distribution across multiple low-power domains.Operating at 650MHz in burst modes, the device balances performance and power consumption for intermittent computing applications.The DDR2 memory architecture implements state-retentive power gating for zero-leakage data preservation during sleep modes.No display controller operates with adaptive refresh rates to minimize power consumption in e-paper applications.GbE (2) PHY includes energy-efficient Ethernet support for green networking applications.The USB 2.0 + PHY (1) interface implements low-power link states while maintaining instant wake-on-connect functionality.Specified for 0°C ~ 70°C (TA) operation, the processor maintains functionality in environmental monitoring applications.The 448-FBGA Exposed Pad package minimizes thermal mass for rapid wake-up from deep sleep states.Offered in 448-PBGA w/Heat Spreader (23x23), the device supports thin-film battery integration in wearable designs.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM1136JF-S
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 650MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: GbE (2)
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 448-FBGA Exposed Pad
- Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)
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