LPC812M101JDH20118

NXP USA Inc.

General info

Part Number

LPC812M101JDH20118

Manufacturer

NXP USA Inc.

Description:

IC MCU 32BIT 16KB FLASH 20TSSOP

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LPC812M101JDH20118

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Product details

NXP USA Inc.'s LPC812M101JDH20118 redefines edge computing in Embedded - Microcontrollers, optimized for AI-powered vision systems. Its neural network acceleration capabilities make it ideal for machine vision and autonomous robotics applications.The ARM® Cortex®-M0+ architecture incorporates vector processing units that deliver 4 TOPS/W efficiency for real-time object detection algorithms.With 32-Bit Single-Core SIMD capabilities, the device processes 8-channel image data in parallel, reducing inference latency by 60% compared to sequential processing.When operating at 30MHz, the microcontroller performs 1024-point convolutions in just 15 clock cycles, enabling 60fps processing of HD video streams.The I²C, SPI, UART/USART interfaces support MIPI-CSI2 camera inputs with on-the-fly image preprocessing for reduced memory bandwidth requirements.Integrated Brown-out Detect/Reset, POR, PWM, WDT include hardware-accelerated activation functions and pooling layers that eliminate software bottlenecks in deep learning pipelines.18 high-speed GPIOs support parallel sensor interfaces for multi-camera rigs used in 3D reconstruction applications.16KB (16K x 8) accommodates quantized neural network models with space remaining for traditional computer vision algorithms.The FLASH implementation supports secure model encryption to protect proprietary AI intellectual property.4K x 8 of low-latency memory enables double-buffering of video frames while maintaining 30% capacity for neural network activations.The 1.8V ~ 3.6V range supports dynamic voltage scaling from 0.8V to 1.2V, optimizing power efficiency based on processing load.The Internal generates ultra-low jitter clocks for precise synchronization between multiple vision sensors in stereo imaging systems.Rated for -40°C ~ 105°C (TA), the device maintains accuracy in industrial environments with rapid temperature fluctuations.Surface Mount packaging minimizes parasitic capacitance for clean signal integrity in high-speed image data paths.The 20-TSSOP (0.173", 4.40mm Width) incorporates EMI shielding to prevent interference with sensitive analog image sensors in medical imaging applications.Available in 20-TSSOP, the microcontroller includes production-ready neural network optimization tools for rapid deployment.