LPC4076FET180557
NXP USA Inc.
LPC4076FET180557
NXP USA Inc.
IC MCU 32BIT 256KB FLSH 180TFBGA
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
LPC4076FET180557
$0.00
Product details
Designed for industrial IoT applications, the LPC4076FET180557 by NXP USA Inc. redefines performance in Embedded - Microcontrollers. Its ultra-low power architecture and robust RF coexistence capabilities make it ideal for wireless sensor networks in smart factory environments.The ARM® Cortex®-M4 core implements dynamic voltage scaling that reduces active power by 40% compared to fixed-voltage designs, extending battery life in remote monitoring nodes.A 32-Bit Single-Core architecture with single-cycle multiply-accumulate units accelerates FFT computations for vibration analysis in predictive maintenance applications.Operating at 120MHz with <1 A/MHz active current, the microcontroller delivers the perfect balance between performance and energy efficiency for energy-harvesting applications.The CANbus, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB interfaces incorporate galvanic isolation support, enabling direct connection to industrial fieldbus networks without external isolation components.Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT include advanced security features like cryptographic accelerators and true random number generators, protecting industrial equipment from cyber threats.256KB (256K x 8) accommodates both the application code and wireless stack, with 20% headroom for future feature expansion in modular industrial controllers.The FLASH implementation supports live firmware updates with rollback protection, ensuring uninterrupted operation during field upgrades.2K x 8 of non-volatile storage maintains calibration data through 1 million write cycles, sufficient for decade-long operation in continuous process monitoring.80K x 8 of retention RAM maintains context during deep sleep modes, enabling instant wake-up response to critical process events.The 2.4V ~ 3.6V range supports direct powering from industrial 24V DC supplies through simple resistive dividers, simplifying power architecture.Precision A/D 8x12b; D/A 1x10b achieve 16-bit effective resolution through oversampling, enabling direct connection to RTD temperature sensors without external amplifiers.The Internal design maintains 0.25% frequency accuracy for wireless protocol timing, eliminating the need for external crystal components in space-constrained designs.Rated for -40°C ~ 85°C (TA), the device operates reliably in foundry environments where ambient temperatures can fluctuate rapidly.Surface Mount packaging withstands repeated thermal shock from -40 C to 125 C, meeting reliability requirements for outdoor industrial installations.The 180-TFBGA format provides 8kV ESD protection on all pins, surviving electrostatic discharges common in plastic injection molding facilities.Available in 180-TFBGA (12x12), the microcontroller supports industrial-grade qualification including 1000-hour HTOL testing at 125 C.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-M4
- Core Size: 32-Bit Single-Core
- Speed: 120MHz
- Connectivity: CANbus, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 80K x 8
- Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
- Data Converters: A/D 8x12b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 180-TFBGA
- Supplier Device Package: 180-TFBGA (12x12)
You May Also Be Interested In