LPC3131FET180,551
NXP USA Inc.
LPC3131FET180,551
NXP USA Inc.
IC MCU 16/32BIT ROMLESS 180TFBGA
Reference Price (USD)
1+
$17.74000
500+
$17.5626
1000+
$17.3852
1500+
$17.2078
2000+
$17.0304
2500+
$16.853
Exquisite packaging
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LPC3131FET180,551
$17.74
Product details
The LPC3131FET180,551 from NXP USA Inc. sets new standards in Embedded - Microcontrollers for building automation systems. Its multi-protocol wireless capabilities and ultra-low power architecture make it perfect for smart HVAC controls and IoT-enabled lighting systems.Featuring ARM926EJ-S technology, this microcontroller executes building control algorithms while consuming just 15 A/MHz in active mode.The 16/32-Bit architecture processes multiple sensor inputs simultaneously, enabling complex occupancy detection algorithms with 99% accuracy.Operating at 180MHz, the device maintains sub-millisecond response times for critical safety systems like smoke detection and emergency lighting control.With EBI/EMI, I²C, Memory Card, SPI, UART/USART, USB OTG support, the microcontroller seamlessly bridges between wired BACnet and wireless Zigbee networks in hybrid building automation systems.Integrated DMA, I²S, LCD, PWM, WDT include precision temperature sensors and humidity measurement circuits that eliminate external components in climate control applications.The ROMless implementation enables secure over-the-air updates for field upgrades without physical access to installed devices.192K x 8 of retention memory preserves system state during power outages, ensuring immediate recovery in critical life safety systems.The 1.1V ~ 3.6V range supports direct operation from 4-20mA current loops commonly used in building automation sensors.Precision A/D 4x10b achieve 0.5 C accuracy in temperature measurement for precise climate control in sensitive environments.The External maintains timing accuracy during battery operation, enabling 10-year operation from a single coin cell in wireless sensors.Rated for -40°C ~ 85°C (TA), the device operates reliably in unconditioned spaces like attics and mechanical rooms.Surface Mount packaging withstands vibration and mechanical stress encountered in HVAC equipment installations.The 180-TFBGA provides enhanced ESD protection for reliable operation in electrically noisy building environments.Available in 180-TFBGA (12x12), the microcontroller is pre-certified for global building automation standards including EN 14908.
Product Attributes
- Product Status: Not For New Designs
- Core Processor: ARM926EJ-S
- Core Size: 16/32-Bit
- Speed: 180MHz
- Connectivity: EBI/EMI, I²C, Memory Card, SPI, UART/USART, USB OTG
- Peripherals: DMA, I²S, LCD, PWM, WDT
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 192K x 8
- Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
- Data Converters: A/D 4x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 180-TFBGA
- Supplier Device Package: 180-TFBGA (12x12)
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