LPC1850FBD208,551

The LPC1850FBD208,551 from NXP USA Inc. represents a cutting-edge solution in Embedded - Microcontrollers, engineered for mission-critical embedded systems. This microcontroller combines robust processing capabilities with exceptional signal integrity, making it ideal for 5G infrastructure and industrial automation applications where timing precision is paramount.Featuring an ARM® Cortex®-M3 architecture, this IC delivers deterministic performance for real-time control applications. When paired with its advanced clock generation circuits, it achieves superior processing efficiency compared to conventional designs.With its 32-Bit Single-Core data path architecture, the device enables concurrent processing of multiple sensor inputs while maintaining ultra-low latency - a critical requirement for industrial IoT edge nodes.Operating at 180MHz, the microcontroller provides the ideal balance between power consumption and throughput, particularly beneficial for battery-powered field instruments requiring extended operational life.The integrated CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG interfaces support daisy-chaining of peripheral devices without compromising signal fidelity, essential for automotive CAN bus implementations and distributed sensor networks.Incorporating Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT, this solution offers comprehensive system monitoring capabilities. The built-in voltage supervision circuits ensure reliable operation even during power rail fluctuations.With 142 configurable GPIOs, designers can implement complex control matrices while maintaining spare capacity for future expansion, particularly valuable in modular industrial equipment.ROMless technology ensures rapid boot times and exceptional data retention, outperforming traditional storage methods in harsh environmental conditions.A 200K x 8 volatile memory configuration supports multi-threaded operation with zero-wait-state access, enabling deterministic response times in motor control applications.The 2.2V ~ 3.6V operating range makes this device compatible with both legacy and modern power architectures, simplifying migration from older systems.Precision A/D 8x10b; D/A 1x10b provide <1 LSB nonlinearity for accurate sensor signal conditioning, particularly important in medical diagnostic equipment where measurement accuracy is critical.The Internal clock source implementation reduces BOM costs while maintaining jitter performance below 1% of period, meeting stringent RF communication requirements.Rated for -40°C ~ 85°C (TA), this microcontroller maintains timing stability across extreme environmental conditions, making it suitable for downhole drilling instrumentation.Surface Mount packaging enables high-density PCB layouts while withstanding mechanical stress, ideal for vibration-prone automotive underhood applications.The 208-LQFP format provides optimal thermal dissipation for continuous operation at maximum clock speeds, addressing thermal challenges in sealed industrial enclosures.Available in 208-LQFP (28x28), the device supports both prototype development and volume production with identical performance characteristics.