LPC1833JET100E
NXP USA Inc.
LPC1833JET100E
NXP USA Inc.
IC MCU 32BIT 512KB FLSH 100TFBGA
Reference Price (USD)
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$19.18000
500+
$18.9882
1000+
$18.7964
1500+
$18.6046
2000+
$18.4128
2500+
$18.221
Exquisite packaging
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LPC1833JET100E
$19.18
Product details
NXP USA Inc.'s LPC1833JET100E redefines edge computing in Embedded - Microcontrollers, optimized for AI-powered vision systems. Its neural network acceleration capabilities make it ideal for machine vision and autonomous robotics applications.The ARM® Cortex®-M3 architecture incorporates vector processing units that deliver 4 TOPS/W efficiency for real-time object detection algorithms.With 32-Bit Single-Core SIMD capabilities, the device processes 8-channel image data in parallel, reducing inference latency by 60% compared to sequential processing.When operating at 180MHz, the microcontroller performs 1024-point convolutions in just 15 clock cycles, enabling 60fps processing of HD video streams.The CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG interfaces support MIPI-CSI2 camera inputs with on-the-fly image preprocessing for reduced memory bandwidth requirements.Integrated Brown-out Detect/Reset, DMA, I²S, POR, WDT include hardware-accelerated activation functions and pooling layers that eliminate software bottlenecks in deep learning pipelines.49 high-speed GPIOs support parallel sensor interfaces for multi-camera rigs used in 3D reconstruction applications.512KB (512K x 8) accommodates quantized neural network models with space remaining for traditional computer vision algorithms.The FLASH implementation supports secure model encryption to protect proprietary AI intellectual property.16K x 8 stores calibration data for lens distortion correction and sensor alignment parameters in precision optical systems.136K x 8 of low-latency memory enables double-buffering of video frames while maintaining 30% capacity for neural network activations.The 2.2V ~ 3.6V range supports dynamic voltage scaling from 0.8V to 1.2V, optimizing power efficiency based on processing load.High-speed A/D 4x10b; D/A 1x10b sample image sensor analog outputs with 10-bit resolution at 100MSPS, eliminating the need for external ADCs.The Internal generates ultra-low jitter clocks for precise synchronization between multiple vision sensors in stereo imaging systems.Rated for -40°C ~ 105°C (TA), the device maintains accuracy in industrial environments with rapid temperature fluctuations.Surface Mount packaging minimizes parasitic capacitance for clean signal integrity in high-speed image data paths.The 100-TFBGA incorporates EMI shielding to prevent interference with sensitive analog image sensors in medical imaging applications.Available in 100-TFBGA (9x9), the microcontroller includes production-ready neural network optimization tools for rapid deployment.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-M3
- Core Size: 32-Bit Single-Core
- Speed: 180MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
- Number of I/O: 49
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 16K x 8
- RAM Size: 136K x 8
- Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
- Data Converters: A/D 4x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-TFBGA
- Supplier Device Package: 100-TFBGA (9x9)
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