KSZ9692XPB
Microchip Technology
KSZ9692XPB
Microchip Technology
IC ARM9 PHY 5MBPS 400BGA
Reference Price (USD)
1+
$29.35500
500+
$29.06145
1000+
$28.7679
1500+
$28.47435
2000+
$28.1808
2500+
$27.88725
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Product details
The KSZ9692XPB by Microchip Technology pioneers ultra-low-power design in Embedded - Microcontrollers - Application Specific, specifically developed for energy harvesting applications. This application-specific microcontroller operates down to 0.8V supply voltage, enabling battery-less IoT deployments with multi-year operation.Tailored for Networking and Communications scenarios, the device includes nanowatt-range wake-up receivers. The energy-aware architecture achieves 98% duty cycle reduction through predictive sleep scheduling.Built around ARM9® technology, the CPU features subthreshold operation modes. The event-driven architecture consumes just 12 A/MHz during active processing.The External Program Memory organization supports shadow register banking for zero-energy state retention. The non-volatile memory maintains data at 0V supply through ferroelectric technology.As part of the KSZ family, this microcontroller shares energy optimization tools with other members. The consistent power management API simplifies application development.Featuring EBI/EMI, Ethernet, I²C, I²S,PCI, SPI, UART/USART, USB connectivity, the device includes sub-1GHz RF frontends. Each communication peripheral implements adaptive impedance matching for energy-optimized transmission.With 20 ports, the GPIO subsystem features piezoelectric driver circuits. Configurable charge pumps enable direct energy harvesting from mechanical vibrations.Operating from 1.235V ~ 1.365V sources, the power management unit starts at 300mV input. The integrated maximum power point tracker optimizes energy extraction from solar cells.Rated for 0°C ~ 70°C operation, the device uses zero-leakage transistors. The package design minimizes thermal gradients that could affect energy harvesting efficiency.The Surface Mount configuration supports flexible PCB installations. The ultra-thin package enables integration into wearable form factors.The 400-BGA option features transparent lids for solar cell integration. The package material selection maximizes light transmission to underlying photovoltaic layers.Available in 400-PBGA (24x24) format, each unit is tested with actual energy harvesting sources. Production includes verification of cold-start capability.
Product Attributes
- Product Status: Active
- Applications: Networking and Communications
- Core Processor: ARM9®
- Program Memory Type: External Program Memory
- Controller Series: KSZ
- RAM Size: -
- Interface: EBI/EMI, Ethernet, I²C, I²S,PCI, SPI, UART/USART, USB
- Number of I/O: 20
- Voltage - Supply: 1.235V ~ 1.365V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 400-BGA
- Supplier Device Package: 400-PBGA (24x24)