KSZ8692XPB

Microchip Technology

General info

Part Number

KSZ8692XPB

Manufacturer

Microchip Technology

Description:

IC ARM9 PHY 10/100MBPS 400BGA

Datasheet:

KSZ8692XPB PDF KSZ8692XPB Datasheet

Reference Price (USD)

$25.39000

500+

$25.1361

1000+

$24.8822

1500+

$24.6283

2000+

$24.3744

2500+

$24.1205

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

KSZ8692XPB

$25.39

Product details

Microchip Technology's KSZ8692XPB reimagines Embedded - Microcontrollers - Application Specific for smart grid and power conversion applications. This application-specific microcontroller integrates advanced PWM generation with high-resolution ADC capabilities, enabling precise control of power electronics.Optimized for Networking and Communications implementations, the device features hardware-based overcurrent protection with 50ns response time. The integrated sigma-delta modulators enable direct sensorless motor control.The ARM9® core includes dedicated trigonometric acceleration units. The parallel execution pipelines achieve 95% duty cycle accuracy at 100kHz switching frequencies.Supporting External Program Memory options, the flash memory incorporates shadow registers for bumpless firmware updates. The dual-plane architecture allows live updates during continuous operation.As a member of the KSZ family, this device shares power library functions with related products. The consistent API simplifies migration between power stages.With EBI/EMI, Ethernet, I²C, I²S,PCI, SPI, UART/USART, USB connectivity, the device supports EtherCAT POWERLINK protocols. Each communication peripheral includes reinforced isolation meeting IEC 61800-5-1 standards.The 20 configurable ports feature 12-bit DAC outputs for analog control. Programmable dead-time insertion prevents shoot-through in bridge configurations.Operating from 1.235V ~ 1.365V inputs, the power architecture withstands 100V transients. The integrated gate drivers support SiC and GaN power devices.Certified for 0°C ~ 70°C operation, the package uses direct-bonded copper substrates. Thermal impedance is minimized for high-current applications.The Surface Mount option supports press-fit assembly for high-power PCBs. The package design accommodates thick copper layers for heat dissipation.Available in 400-BGA format, the package includes Kelvin sense connections. The low-inductance design minimizes switching losses at high di/dt rates.Supplied in 400-PBGA (24x24) configuration, each unit includes power cycling test reports. Production testing includes 100% burn-in at maximum junction temperature.