KRF25-12

The KRF25-12 by Elpress Inc. delivers breakthrough performance in Terminals - Rectangular Connectors for data center power distribution. This high-density connector minimizes voltage drop in server rack applications, featuring innovative cooling technologies that prevent thermal buildup. The design optimizes power delivery efficiency while meeting stringent data center reliability and space utilization requirements.Featuring Ring, Tubular technology, this connector minimizes contact resistance in high-current server applications. The silver-alloy contacts maintain stable performance despite constant load fluctuations.With M12 Stud options, this terminal accommodates diverse rack power distribution schemes. The contacts are engineered for minimal insertion force without compromising current capacity.The 0.114" (2.90mm) construction optimizes thermal dissipation in confined server racks. This thickness is calculated to balance current density with heat rejection requirements.Measuring 1.850" (46.99mm), this connector provides proper cable management in high-density racks. The length includes strain relief for organized cable routing.The 0.866" (22.00mm) profile allows maximum power connections per rack unit. This space-efficient design meets hyperscale data center density targets.Designed for Free Hanging (In-Line) installation, this terminal facilitates rapid rack deployment and reconfiguration. The tool-less design minimizes downtime during capacity expansions.Utilizing Crimp technology, this connector ensures gas-tight connections for minimal oxidation. The termination method maintains low resistance over thousands of thermal cycles.Compatible with 4 AWG conductors, this terminal handles both primary and redundant power feeds. The design prevents conductor deformation during high-density bundling.The Non-Insulated system provides flame-retardant protection for critical data center applications. The material meets UL94 V-0 standards without compromising flexibility.Incorporating UL Listed, this connector exceeds Tier IV data center reliability requirements. These include integrated temperature monitoring and airflow optimization designs.