KMPC853TVR66A
NXP USA Inc.
KMPC853TVR66A
NXP USA Inc.
IC MPU MPC8XX 166MHZ 256BGA
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Product details
The KMPC853TVR66A from NXP USA Inc. delivers military-grade reliability in the Embedded - Microprocessors category, hardened for aerospace and defense applications. This radiation-hardened microprocessor combines triple-modular redundancy with error-correcting architectures, meeting MIL-STD-883 requirements for mission-critical systems.Featuring a MPC8xx radiation-hardened core, the processor implements lockstep execution with cycle-by-cycle comparison for fault detection.The 1 Core, 32-Bit configuration includes redundant execution units for single-event upset mitigation in space applications.Operating at 166MHz, the device meets the real-time processing requirements of spacecraft attitude control systems.The Communications; CPM units include radiation-hardened floating-point accelerators for spacecraft navigation.DRAM memory interfaces incorporate SECDED ECC protection for single-event upset mitigation in orbit.No display controllers include radiation-hardened frame buffers for critical spacecraft displays.10Mbps (1) implementations include space-grade PHYs with enhanced EMI characteristics for spacecraft applications.3.3V tolerant I/Os withstand transient voltage spikes common in military electrical systems.Qualified for 0°C ~ 95°C (TA) operation, the processor functions in extreme space and high-altitude environments.The 256-BBGA package implements hermetic sealing for protection against moisture and contaminants.Available in 256-PBGA (23x23), the device supports military-grade PCB assembly processes.
Product Attributes
- Product Status: Obsolete
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 166MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (23x23)
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