KMPC8250AVVPIBC
NXP USA Inc.
KMPC8250AVVPIBC
NXP USA Inc.
IC MPU MPC82XX 300MHZ 480TBGA
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Product details
NXP USA Inc.'s KMPC8250AVVPIBC revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The PowerPC G2 core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 1 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 300MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.The Communications; RISC CPM units accelerate OFDM processing and channel coding algorithms.High-bandwidth DRAM, SDRAM memory interfaces support the massive data flows characteristic of 5G signal processing.No graphics capabilities enable visualization of network performance metrics in real-time.10/100Mbps (3) implementations provide the necessary throughput for CPRI and eCPRI interfaces in 5G radios.3.3V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for 0°C ~ 105°C (TA) operation, the processor maintains performance in outdoor radio unit installations.The 480-LBGA Exposed Pad package design optimizes thermal performance for continuous high-load operation.Available in 480-TBGA (37.5x37.5), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC G2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 300MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100Mbps (3)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 480-LBGA Exposed Pad
- Supplier Device Package: 480-TBGA (37.5x37.5)
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