IMSA-11501S-50A-GFN1

IRISO USA Inc.

General info

Part Number

Manufacturer

IRISO USA Inc.

Description:

CONN FFC R/A .5MM 50POS

Reference Price (USD)

$2.68000

500+

$2.6532

1000+

$2.6264

1500+

$2.5996

2000+

$2.5728

2500+

$2.546

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

IMSA-11501S-50A-GFN1

$2.68

Product details

IRISO USA Inc.'s IMSA-11501S-50A-GFN1 sets new benchmarks in FFC, FPC (Flat Flexible) Connectors technology, optimized for mission-critical signal transmission. This high-reliability connector combines advanced materials science with precision engineering to deliver unmatched performance in 5G infrastructure applications.Designed specifically for FFC, FPC implementations, this connector features impedance-matched signal paths. The embedded shielding technology reduces EMI by 15dB compared to standard designs.The Surface Mount, Right Angle configuration enables high-speed pick-and-place assembly. Vision-system compatible fiducials ensure 0.05mm placement accuracy.Engineered with Contacts, Bottom topology, this solution provides 360 shielding effectiveness. The multi-point contact system distributes current flow evenly.Supporting 50 contact positions, this high-density interconnect maintains 100 differential impedance. The staggered contact arrangement minimizes crosstalk.The 0.020" (0.50mm) micro-pitch design incorporates anti-wicking barriers for solder control. Laser-trimmed contacts ensure coplanarity within 0.08mm tolerance.Solder process features lead-free solder compatibility. The thermal mass balanced design prevents tombstoning during reflow.Accommodating 0.30mm cable thicknesses, the strain-relief system withstands 5N pull force. The graduated clamping pressure prevents cable deformation.With 0.134" (3.40mm) vertical clearance, this solution enables stacked PCB configurations. The low-insertion-force design requires <2N mating force.Notched interface design incorporates color-coded polarization. The chamfered entry guides facilitate blind mating operations.Copper Alloy formulation delivers stable contact resistance over temperature. The beryllium-free alloy meets EU Directive 2011/65/EU requirements.The Gold plating achieves <10m initial contact resistance. The 50 gold flash over nickel barrier prevents fretting corrosion.Liquid Crystal Polymer (LCP) compound provides excellent dielectric properties. The glass-reinforced structure maintains rigidity in high-temperature environments.Solder Retention implementation includes ESD protection up to 15kV. The auto-eject mechanism prevents cable damage during disconnection.Tested at 50V with 1000V dielectric withstand. The insulated barrier design prevents arc-over in humid conditions.Meeting UL94 V-0 requirements, the material formulation produces minimal smoke density. The self-extinguishing properties exceed FAA standards.